The Journal is Abstracted/Indexed in:
SCImago Journal & Country Rank (SJR) www.scimagojr.com.
Inspec (IET, Institution of Engineering Technology) www.theiet.org.
Chemical Abstracts Service (CAS) www.cas.org.
Google Scholar scholar.google.com.
NASA Astrophysics Data System (ADS) http://www.adsabs.harvard.edu/.
Cambridge Scientific Abstracts (CSA) www.csa.com.
ProQuest www.proquest.com.
Ulrichsweb www.proquest.com/products-services/Ulrichsweb.html.
EBSCOhost Research Databases www.ebscohost.com/.
CiteSeerX citeseerx.ist.psu.edu.
Zetoc zetoc.jisc.ac.uk.
Index Copernicus Journals Master List www.indexcopernicus.com.
WorldCat (OCLC) www.worldcat.org.
“Applied Mechanics and Materials” is a peer-reviewed journal which specializes in rapid publication of proceedings of international scientific conferences, workshops and symposia as well as special volumes on topics of contemporary interest in all areas which are related to:
1) Research and design of mechanical systems, machines and mechanisms;
2) Materials engineering and technologies for manufacturing and processing;
3) Systems of automation and control in the areas of industrial production;
4) Advanced branches of mechanical engineering such as mechatronics, computer engineering and robotics.
The Editor-in-Chief is Prof. Xipeng Xu
Huaqiao University, Research Institute of Manufacturing Engineering at Huaqiao University; No.668, Jimei Road, Xiamen, China, 361021;
The manuscripts will be reviewed by the Conference Chairs.
All manuscripts will be subject to the Publisher’s conference ethics and quality control:
A conference is a place where researchers with similar interest present and discuss their latest findings. Papers will need to be written in clear English and describe current original research of international interest which has not been submitted elsewhere and of at least 6 pages in length.
ICDDMAP is dedicated to meeting the IEEE current conference ethics and quality control in proceedings publication. See the white paper written by IEEE which is endorsed by most major publishers and by ICDDMAP 2017.